HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 546

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

14.1
An IC card (smart card) interface conforming to the ISO/IEC 7816-3 (Identification Card)
standard is supported as an extension of the serial communication interface (SCI) functions.
Switchover between the normal serial communication interface and the smart card interface is
controlled by a register setting.
14.1.1
Features of the smart card interface supported by the H8/3029 are listed below.
Asynchronous communication
Built-in baud rate generator allows any bit rate to be selected
Three interrupt sources
Data length: 8 bits
Parity bit generation and checking
Transmission of error signal (parity error) in receive mode
Error signal detection and automatic data retransmission in transmit mode
Direct convention and inverse convention both supported
There are three interrupt sources—transmit-data-empty, receive-data-full, and
transmit/receive error—that can issue requests independently.
The transmit-data-empty interrupt and receive-data-full interrupt can activate the DMA
controller (DMAC) to execute data transfer.
Overview
Features
Section 14 Smart Card Interface
Rev. 2.0, 06/04, page 517 of 980