HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 609

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.2.2
When each mode pin and the FWE pin are set in the reset state and reset start is performed, the
microcomputer enters each operating mode as shown in figure 18.2. For the setting of each mode
pin and the FWE pin, see table 18.1.
Rev. 2.0, 06/04, page 580 of 980
Flash memory cannot be read, programmed, or erased in ROM invalid mode.
Flash memory can be read in user mode, but cannot be programmed or erased.
Flash memory can be read, programmed, or erased on the board only in user program mode,
user boot mode, and boot mode.
Flash memory can be read, programmed, or erased by means of the PROM programmer in
PROM mode.
ROM invalid
User mode
RAM emulation is enabled
mode
Operating Mode
FWE=0
FWE=1
Figure 18.2 Mode Transition of Flash Memory
ROM invalid
mode setting
4-5
User program
=0
mode
Reset state
On-board programming mode
User boot
mode
PROM mode setting
4-5
=0
PROM mode
Boot mode