HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 182
HD64F3029XBL25V
Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.HD64F3029X25.pdf
(1012 pages)
Specifications of HD64F3029XBL25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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16-Bit, Two-State-Access Areas: Figures 6.14 to 6.16 show the timing of bus control signals for
a 16-bit, two-state-access area. In these areas, the upper data bus (D
even addresses and the lower data bus (D
be inserted.
Figure 6.14 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1)
Write access
Read access
Note: n = 7 to 0
Address bus
D
D
D
D
HWR
15
LWR
15
CS
7
7
RD
AS
(Byte Access to Even Address)
to D
to D
to D
to D
n
0
0
8
8
7
to D
Even external address in area n
0
) in accesses to odd addresses. Wait states cannot
High
T
1
Bus cycle
Undetermined data
Valid
Rev. 2.0, 06/04, page 153 of 980
Invalid
T
Valid
2
15
to D
8
) is used in accesses to
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