HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 81

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Rev. 2.0, 06/04, page 52 of 980
Notes: *1
RES = "High"
Exception-handling state
Bus-released state
*2
Reset state
From any state except hardware standby mode, a transition to the reset state occurs
whenever
From any state, a transition to hardware standby mode occurs when
End of
exception
handling
End of bus
release
4-5
*1
goes low.
Bus
request
STBY="High", RES ="Low"
Figure 2.13 State Transitions
Program execution state
NMI, IRQ , IRQ ,
or IRQ interrupt
Exception
Interrupt source
End of bus release
handling source
Bus request
2
0
1
SLEEP instruction
with SSBY = 1
SLEEP
instruction
with SSBY = 0
Hardware standby mode
Software standby mode
Power-down state
Sleep mode
56*;
goes low.
*2