HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 775

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
Reference current
RAM standby voltage
V
voltage*
Notes: *1 If the A/D converter is not used, do not leave the AV
Rev. 2.0, 06/04, page 746 of 980
CL
output
*2 Current dissipation values are for V
*3 I
*4 Sum of current dissipation in normal operation and current dissipation in program/erase
*5 This value is applied when the external capacitor of 0.1 µF is connected.
5
Connect AV
output pins unloaded and the on-chip MOS pull-up transistors in the off state.
I
I
The Typ values for power consumption are reference values.
operations.
This characteristic does not specify the permissible range of voltage input from the
external circuit but specifies the voltage output by the LSI.
CC
CC
CC
max. (normal operation) = 11 (mA) + 0.13 (mA/(MHz
max. (sleep mode)
max. (sleep mode + module standby mode)
During A/D
conversion
During A/D and
D/A conversion
Normal
operation
CC
and V
REF
to V
CC
= 11 (mA) + 0.11 (mA/(MHz
= 11 (mA) + 0.10 (mA/(MHz
Symbol
AI
V
V
, and connect AV
RAM
CL
CC
IH
min = V
Min
—
—
3.0
1.5
CC
SS
– 0.5 V and V
Typ
0.25
1.2
—
1.9
to V
CC
SS
.
, V
REF
Max
0.8
3.0
—
2.3
V))
V))
V))
, and AV
IL
max = 0.5 V with all
V
V
V
CC
CC
CC
Unit
mA
mA
V
V
SS
f
f
f
pins open.
Test
Conditions
V
T
a
CC
= 25°C
= 3.3 V,