HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 261

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
When activated by a transfer request, the DMAC executes a burst transfer. During the transfer
MARA and MARB are updated according to the DTCR settings, and ETCRAH is decremented.
When ETCRAH reaches H'00, it is reloaded from ETCRAL to restore the initial value. The
memory address register of the block area is also restored to its initial value, and ETCRB is
decremented. If ETCRB is not H'0000, the DMAC then waits for the next transfer request.
ETCRAH and ETCRAL should be initially set to the same value.
The above operation is repeated until ETCRB reaches H'0000, at which point the DTE bit is
cleared to 0 and the transfer ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this
time.
Figure 7.11 shows examples of a block transfer with byte data size when the block area is the
destination. In (a) the block area address is cycled. In (b) the block area address is held fixed.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 2, by an A/D converter conversion-end interrupt, and by external request signals.
For the detailed settings see section 7.3.4, Data Transfer Control Registers (DTCR).
Rev. 2.0, 06/04, page 232 of 980

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