HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 710

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
NMI Handling Routine
Operation for Inhibit of Interrupt
Operation for Writing H'5A to
Key Register
Operation for Settings of
Program Parameter
Execution of Programming
Judgement of Program Result
Operation for Program Error
Operation for Key Register
Clear
Note:
* Transferring the data to the on-chip RAM enables this area to be used.
Storable /Executable Area
On-chip
RAM
User
MAT
External Space
(Expanded Mode)
Rev. 2.0, 06/04, page 681 of 980
Selected MAT
User
MAT
Embedded
Program Storage
Area