HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 705

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.24 AC Characteristics Auto-Erase Mode
Condition : V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
Status polling start time
Status polling access time
Memory erase time
Erase setup time
Erase end setup time
WE rise time
WE fall time
Rev. 2.0, 06/04, page 676 of 980
I/O5-0
A18-0
FWE
I/O7
I/O6
WE
OE
CE
CC
t
ens
= 3.0 V to 3.6 V, V
t
ces
tf
t
t
ds
wep
Figure 18.34 Timing in Auto-Erase Mode
H'20 or
H'25
t
t
t
t
Symbol
t
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
ests
spa
erase
ens
enh
r
f
t
tr
ceh
t
dh
SS
t
nxtc
= 0 V, T
Min
20
0
0
50
50
70
1
100
100
100
a
H'20 or
H'25
= 25°C ± 5°C
Erase normal
and confirmation
signal
Erase end
identification
signal
t
ests
Max
150
40000
30
30
t
erase
t
spa
H'00
Unit
µs
ns
ns
ns
ns
ns
ms
ns
ms
ns
ns
ns
ns
t
e nh
t
nxtc
Note