HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 982

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

PB
3
WPBD:
WPB:
RPB:
SSOE:
Note: Area 4 DRAM connection output enable, RAS
and CS
Write to PBDDR
Write to port B
Read port B
Software standby output port enable
4
output enable are all fixed at 0 in mode 7.
Hardware
standby
Figure C.11 (d) Port B Block Diagram (Pin PB
Mode 7
SSOE
Software standby
External bus release
Q
Q
4
PB
PB
WPBD
output enable,
Reset
Reset
3
R
C
R
C
3
RPB
DDR
DR
D
D
WPB
Rev. 2.0, 06/04, page 953 of 980
3
)
TPC
8-bit timer
DMAC
Bus controller
RAS
Area 4 DRAM connection
output enable
TPC output enable
Next data
Output trigger
Output enable
Compare match output
CS
TMIO
DREQ
4
4
output enable
output enable
RAS
CS
3
1
4
input
input
4
output
output