HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 883

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

FECS—Flash Erase Code Register
FPCS—Flash Program Code Select Register
Rev. 2.0, 06/04, page 854 of 980
Initial value
Read/Write
Initial value
Read/Write
Bit
Bit
R
R
7
0
7
0
R
R
6
0
6
0
Program pulse verify block
0
1
R
R
5
0
5
0
On-chip programming control program is not selected (Initial value)
[Clearing condition] When transfer has finished
On-chip programming control program is selected
Reserved bits
Reserved bits
Erase pulse verify block
0
1
R
R
4
0
4
0
On-chip erase program is not selected (Initial value)
[Clearing condition] When transfer has finished
On-chip erase program is selected
R
R
3
0
3
0
H'EE0B2
H'EE0B1
R
R
2
0
2
0
Flash Memory
Flash Memory
R
R
1
0
1
0
EPVB
PPVS
R/W
R/W
0
0
0
0