HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 788

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
21.4.2
Control signal timing is shown as follows:
RES
FWE
MD
NMI
IRQ
IRQ
Reset input timing
Figure 21.11 shows the reset input timing.
Interrupt input timing
Figure 21.12 shows the interrupt input timing for NMI and IRQ
2
E
L
to MD
IRQ : Edge-sensitive IRQ
IRQ
(j = 0 to 5)
NMI
IRQ
Control Signal Timing
E
L
0
: Level-sensitive IRQ (i = 0 to 5)
j
Figure 21.12 Interrupt Input Timing
Figure 21.11 Reset Input Timing
t
MDS
i
i
t
t
t
NMIS
NMIS
NMIS
t
RESS
t
t
t
NMIH
NMIH
NMIW
t
RESS
Rev. 2.0, 06/04, page 759 of 980
5
to IRQ
t
RESW
0
.

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