HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 27

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.9 PROM Mode..................................................................................................................... 639
18.10 Further Information........................................................................................................... 646
Section 19 Clock Pulse Generator .....................................................................689
19.1 Overview........................................................................................................................... 689
19.2 Oscillator Circuit............................................................................................................... 690
19.3 Duty Adjustment Circuit................................................................................................... 694
19.4 Prescalers .......................................................................................................................... 694
19.5 Frequency Divider ............................................................................................................ 694
Section 20 Power-Down State...........................................................................697
20.1 Overview........................................................................................................................... 697
20.2 Register Configuration...................................................................................................... 699
20.3 Sleep Mode ....................................................................................................................... 704
20.4 Software Standby Mode.................................................................................................... 705
Rev. 2.0, 06/04, page xxii of xxiv
18.8.1 Usage Notes ......................................................................................................... 638
18.9.1 Pin Arrangement of the Socket Adapter .............................................................. 639
18.9.2 PROM Mode Operation ....................................................................................... 641
18.9.3 Memory-Read Mode............................................................................................ 642
18.9.4 Auto-Program Mode ............................................................................................ 643
18.9.5 Auto-Erase Mode................................................................................................. 643
18.9.6 Status-Read Mode................................................................................................ 644
18.9.7 Status Polling ....................................................................................................... 644
18.9.8 Time Taken in Transition to PROM Mode .......................................................... 645
18.9.9 Notes on Using PROM Mode .............................................................................. 645
18.10.1 Serial Communication Interface Specification for Boot Mode............................ 646
18.10.2 AC Characteristics and Timing in Writer Mode .................................................. 672
18.10.3 Procedure Program and Storable Area for Programming Data.......................... 678
19.1.1 Block Diagram ..................................................................................................... 689
19.2.1 Connecting a Crystal Resonator........................................................................... 690
19.2.2 External Clock Input............................................................................................ 692
19.5.1 Register Configuration......................................................................................... 695
19.5.2 Division Control Register (DIVCR) .................................................................... 695
19.5.3 Usage Notes ......................................................................................................... 696
20.2.1 System Control Register (SYSCR) ...................................................................... 699
20.2.2 Module Standby Control Register H (MSTCRH)................................................ 701
20.2.3 Module Standby Control Register L (MSTCRL)................................................. 702
20.3.1 Transition to Sleep Mode..................................................................................... 704
20.3.2 Exit from Sleep Mode.......................................................................................... 704
20.4.1 Transition to Software Standby Mode ................................................................. 705
20.4.2 Exit from Software Standby Mode ...................................................................... 705
20.4.3 Selection of Waiting Time for Exit from Software Standby Mode ..................... 706
20.4.4 Sample Application of Software Standby Mode.................................................. 707