HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 676

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

The bit rate is calculated by measuring the period of transfer of a low-level byte (H'00) from the
host. The bit rate can be changed by the command for a new bit rate selection. After the bit rate
has been adjusted, the boot program enters the inquiry and selection state. The bit-rate-adjustment
sequence is shown in figure 18.24.
Bit-Rate-Adjustment state
Programming/erasing
Operations for Erasing
User MATs and User
selection wait
Transition to
Programming/erasing
Boot MATs
Programming
Operations for
Bit-Rate-Adjustment
Programming
Inquiry/Selection
Figure 18.23 Boot Program States
State
wait
Reset
Inquiry
Erasing
Operations for
Operations for
Inquiry
Erasing
Rev. 2.0, 06/04, page 647 of 980
Selection
Checking
Operations for
Operations for
Selection
Checking