HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 266

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
7.4.8
Figure 7.13 shows an example of the timing of the basic DMAC bus cycle. This example shows a
word-size transfer from a 16-bit two-state access area to an 8-bit three-state access area. When the
DMAC gets the bus from the CPU, after one dead cycle (T
writes to the destination address. During these read and write operations the bus is not released
even if there is another bus request. DMAC cycles comply with bus controller settings in the same
way as CPU cycles.
Address
bus
RD
HWR
LWR
DMAC Bus Cycle
T
1
CPU cycle
T
2
Figure 7.13 DMA Transfer Bus Timing (Example)
T
1
T
2
T
d
T
Source
address
1
DMAC cycle (1 word transfer)
T
2
T
1
T
Destination address
2
T
d
), it reads from the source address and
3
T
1
Rev. 2.0, 06/04, page 237 of 980
T
2
T
3
T
1
T
CPU cycle
2
T
1
T
2

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