HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 499

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

For smart card interface (SMIF bit in SCMR set to 1): These bits, together with the GM bit in
SMR, determine whether the SCK pin is used for generic input/output or as the serial clock output
pin.
SMR
GM
0
0
1
1
1
1
Rev. 2.0, 06/04, page 470 of 980
Bit 1
CKE1
0
0
0
0
1
1
Bit 0
CKE0 Description
0
1
0
1
0
1
SCK pin available for generic input/output
SCK pin used for clock output
SCK pin output fixed low
SCK pin used for clock output
SCK pin output fixed high
SCK pin used for clock output
(Initial value)