HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 36

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
1.2
Figure 1.1 shows an internal block diagram.
ADTRG/CS
RFSH/IRQ
CS
CS
Block Diagram
1
2
3
BREQ/P6
BACK/P6
WAIT/P6
/IRQ
/IRQ
/IRQ
HWR/P6
LWR/P6
CS
RD/P6
AS/P6
EXTAL
STBY
0
3
2
1
0
MD
MD
MD
XTAL
FWE
/P6
/P8
/P8
/P8
/P8
/P8
RES
NMI
2
1
0
7
6
5
4
3
2
1
0
4
3
2
1
0
Port B
Figure 1.1 Block Diagram
Interrupt controller
controller (TPC)
16-bit timer unit
(flash memory)
Programmable
8-bit timer unit
timing pattern
ROM
RAM
Port A
H8/300H CPU
Port 3
DMA controller
Serial communication
(SCI)
(DMAC)
Watchdog timer
A/D converter
D/A converter
Address bus
Data bus (upper)
Data bus (lower)
interface
(WDT)
3 channels
Rev. 2.0, 06/04, page 7 of 980
Port 4
Port 7
P5 /A
P5 /A
P5 /A
P5 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P2 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P1 /A
P9 /SCK /IRQ
P9 /SCK /IRQ
P9 /RxD
P9 /RxD
P9 /TxD
P9 /TxD
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
5
4
3
2
1
0
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
0
1
0
1
0
5
4

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