HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 225

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
BRCR Write Timing: Data written to BRCR to switch between A
generic input or output takes effect starting from the T
6.51 shows the timing when a pin is changed from generic input to A
6.11.2
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high
level before BACK goes lows, the bus arbiter may operate incorrectly.
To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If
BREQ is high for too short an interval, the bus arbiter may operate incorrectly.
Rev. 2.0, 06/04, page 196 of 980
BREQ
BREQ Pin Input Timing
BREQ
BREQ
Address bus
( A
PA
23
to A
7
to PA
20
)
4
Figure 6.51 BRCR Write Timing
High-impedance
T
1
BRCR address
3
state of the BRCR write cycle. Figure
T
2
23
T
, A
3
23
, A
22
, A
22
, A
21
, or A
21
, or A
20
output and
20
output.

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