HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 369

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Bit 3—Output Level Setting B1 (TOB1): Sets the value of timer output TIOCB
Bit 3
TOB1
0
1
Bit 2—Output Level Setting A1 (TOA1): Sets the value of timer output TIOCA
Bit 2
TOA1
0
1
Bit 1—Output Level Setting B0 (TOB0): Sets the value of timer output TIOCB
Bit 0
TOB0
0
1
Bit 0—Output Level Setting A0 (TOA0): Sets the value of timer output TIOCA
Bit 0
TOA0
0
1
Rev. 2.0, 06/04, page 340 of 980
Description
Description
Description
Description
TIOCB
TIOCB
TIOCA
TIOCA
TIOCB
TIOCB
TIOCA
TIOCA
1
1
1
1
0
0
0
0
is 0
is 1
is 0
is 1
is 0
is 1
is 0
is 1
1
0
1
0
.
.
.
.
(Initial value)
(Initial value)
(Initial value)
(Initial value)

Related parts for HD64F3029XBL25V