HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 800

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
21.4.7
SCI timing is shown as follows:
SCK
SCK
TxD
(transmit
data)
RxD
(receive
data)
SCI input clock timing
Figure 21.25 shows the SCI input clock timing.
SCI input/output timing (synchronous mode)
Figure 21.26 shows the SCI input/output timing in synchronous mode.
0
0
0
1
,
to TxD
to RxD
SCK
SCI Input/Output Timing
2
2
0
to SCK
Figure 21.26 SCI Input/Output Timing in Synchronous Mode
2
t
Figure 21.25 SCI Input Clock Timing
TXD
t
Scyc
t
SCKW
t
RXS
t
RXH
t
Scyc
Rev. 2.0, 06/04, page 771 of 980
t
SCKr
t
SCKf

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