HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 204

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 6.31 Interconnections and Address Map for 2-CAS 16-Mbit DRAMs with
H8/3029
CS
CS
PB
PB
Area 2
Area 3
Area 4
Area 5
RD (WE)
4
2
3
5
(UCAS)
(LCAS)
(RAS
(RAS
D
A
15
10
-A
-D
2
3
H'400000
H'5FFFFE
H'600000
H'7FFFFE
H'800000
H'9FFFFE
H'A00000
H'BFFFFE
)
)
1
0
(a) Interconnections (example)
(b) Address map
(UCAS)
15
Organization
PB
DRAM (No.1)
DRAM (No.2)
4
Normal
Normal
8
7
(LCAS)
PB
10-bit row address x 10-bit column address
5
0
CS
CS
CS
CS
RAS
UCAS
LCAS
WE
RAS
UCAS
LCAS
WE
A
D
A
D
2
3
4
5
9
9
(RAS
(RAS
2-CAS 16-Mbit DRAM
15
15
-A
-A
x16-bit organization
-D
-D
0
0
0
0
2
3
Rev. 2.0, 06/04, page 175 of 980
)
)
OE
OE
No.1
No.2
16-Bit