HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 525

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Communication Formats: Four formats are available. Parity bit settings are ignored when a
multiprocessor format is selected. For details see table 13.10.
Clock: See the description of asynchronous mode.
Transmitting and Receiving Data:
Rev. 2.0, 06/04, page 496 of 980
Figure 13.9 Example of Communication among Processors using Multiprocessor Format
Serial data
Transmitting Multiprocessor Serial Data: Figure 13.10 shows a sample flowchart for
transmitting multiprocessor serial data and indicates the procedure to follow.
Legend
MPB : Multiprocessor bit
Transmitting
processor A
Receiving
processor
(ID=01)
(Sending Data H'AA to Receiving Processor A)
ID-sending cycle:
receiving processor address
H'01
processor B
Receiving
(ID=02)
(MPB=1)
Serial communication line
Data-sending cycle:
data sent to receiving processor
specified by ID
processor C
Receiving
H'AA
(ID=03)
(MPB=0)
Receiving
processor D
(ID=04)

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