HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 391

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Timing of Setting of IMFA and IMFB by Input Capture: IMFA and IMFB are set to 1 by an
input capture signal. The 16TCNT contents are simultaneously transferred to the corresponding
general register. Figure 9.34 shows the timing.
Rev. 2.0, 06/04, page 362 of 980
Input capture
signal
IMF
16TCNT
GR
IMI
Figure 9.34 Timing of Setting of IMFA and IMFB by Input Capture
N
N

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