HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 801

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.4.8
DMAC timing is shown as follows.
Rev. 2.0, 06/04, page 772 of 980
DMAC TEND output timing for 2 state access
Figure 21.27 shows the DMAC TEND output timing for two state access.
DMAC TEND output timing for 3 state access
Figure 21.28 shows the DMAC TEND output timing for three state access.
DMAC DREQ input timing
Figure 21.29 shows DMAC DREQ input timing.
TEND
DMAC Timing
Figure 21.28 DMAC TEND
Figure 21.27 DMAC TEND
TEND
t
TED1
DREQ
Figure 21.29 DMAC DREQ
T
1
t
TED1
TEND Output Timing for three State Access
TEND
TEND
TEND
TEND Output Timing for two State Access
TEND
T
1
t
DRQS
T
2
DREQ
DREQ
DREQ Input Timing
t
DRQH
T
2
T
3
t
TED2
t
TED2