HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 722

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 19.3 Clock Timing
Item
External clock input low
pulse width
External clock input high
pulse width
External clock rise time
External clock fall time
Clock low pulse width
Clock high pulse width
External clock output
settling delay time
Note:
EXTAL
* t
DEXT
includes a RES pulse width (t
Figure 19.6 External Clock Input Timing
Symbol Min
t
t
t
t
t
t
t
EXL
EXH
EXr
EXf
CL
CH
DEXT
t
EXr
*
t
EXH
V
15
15
—
—
0.4
0.4
500
CC
= 3.0 V to 3.6 V
RESW
). t
RESW
V
0.3 V
Max
—
—
5
5
0.6
0.6
—
CC
t
= 20 t
EXf
0.7
cyc
t
EXL
Rev. 2.0, 06/04, page 693 of 980
Unit
ns
ns
ns
ns
t
t
µs
cyc
cyc
Test Conditions
Figure 19.6
Figure 19.7
Figure 21.13
V
CC
0.5