HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 943

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
TDR—Transmit Data Register
SSR—Serial Status Register
RDR—Receive Data Register
Rev. 2.0, 06/04, page 914 of 980
Notes: Bit functions are the same as for SCI0.
Note: Bit functions are the same as for SCI0.
Note: Bit functions are the same as for SCI0.
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
* Only 0 can be written, to clear the flag.
Bit
Bit
Bit
R/(W)*
TDRE
R/W
7
1
R
7
1
7
0
R/(W)*
RDRF
R/W
6
0
R
6
0
6
1
R/(W)*
ORER
R/W
R
5
0
5
0
5
1
FER/ERS
R/(W)*
R/W
R
4
0
4
1
4
0
R/(W)*
R/W
PER
R
3
0
3
1
3
0
H'FFFC3
H'FFFC4
H'FFFC5
TEND
R/W
R
2
0
2
1
R
2
1
R/W
MPB
R
1
0
1
1
R
1
0
SCI2
SCI2
SCI2
R/W
MPBT
R/W
R
0
0
0
1
0
0

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