HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 320

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Pin
P9
P9
1
0
/TxD
/TxD
1
0
Pin Functions and Selection Method
Bit TE in SCR of SCI1, bit SMIF in SCMR, and bit P9
SMIF
TE
P9
Pin function
Note: * Functions as the TxD
Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P9
SMIF
TE
P9
Pin function
Note: * Functions as the TxD
1
0
DDR
DDR
driven, and another in which the pin is at high-impedance.
driven, and another in which the pin is at high-impedance.
P9
P9
1
0
1
0
output pin, but there are two states: one in which the pin is
output pin, but there are two states: one in which the pin is
0
0
input
input
0
0
P9
P9
1
0
output
output
1
1
0
0
1
0
DDR select the pin function as follows.
DDR select the pin function as follows.
Rev. 2.0, 06/04, page 291 of 980
TxD
TxD
1
0
1
1
output
output
TxD
TxD
1
0
output*
output*
1
1

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