HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 31

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Notes on using the on-chip debugging functions incorporated in the H8/3029
The following must be noted when developing and debugging H8/3029 programs using the on-
chip debugging function.
1. The on-chip emulator supports only the development and debugging of programs on the on-
2. Since the DRAM interface and DMAC does not operate, do not set the registers for these
3. In the break mode of on-chip emulation, the watchdog timer (WDT) stops counting.
4. The FWE (BRK), P91, P93, and P95 pins are specifically used by the E10T and cannot be
5. In the 16-Mbyte address mode, address area from H'FF7000 to H'FF7FFF is used by the E10T
6. Emulation of hardware standby mode can not be performed.
Rev. 2.0, 06/04, page 2 of 980
chip flash memory. The on-chip emulator cannot emulate external memory or when the LSI is
in ROM-disabled modes.
modules.
Therefore, the WDT count will be different from the expected value after leaving break mode.
used by the user.
and cannot be used by the user.