HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 774

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Item
Three-state
leakage
current
Input pull-up
MOS current
Input
capacitance
Current
dissipation*
Analog power
supply current
2
Ports 1 to 6,
Ports 8 to B
Ports 2, 4,
and 5
FWE
NMI
All input pins
except NMI
Normal
operation
Sleep mode
Module
standby mode
Flash memory
programming/
erasing*
During A/D
conversion
During A/D
and D/A
conversion
4
Symbol
|I
–I
C
I
AI
CC
TSI
in
p
CC
*
|
3
Min
10
Typ
20(3.3V)
17(3.3V)
16(3.3V)
30(3.3V)
0.6
0.6
Max
1.0
300
80
50
15
38
35
34
48
1.5
1.5
Rev. 2.0, 06/04, page 745 of 980
µA
Unit
µA
pF
pF
pF
mA
mA
mA
mA
mA
mA
Test
Conditions
V
V
V
V
f = f
T
f = 25 MHz
f = 25 MHz
f = 25 MHz
f = 25 MHz
(reference
values)
a
in
CC
in
in
= 25°C
= 0.5 V to
= 0 V
= 0 V,
– 0.5 V
min
,

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