HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 271

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 7.18 shows the timing when the DMAC is activated by the falling edge of DREQ in block
transfer mode.
Rev. 2.0, 06/04, page 242 of 980
Figure 7.18 Timing of DMAC Activation by Falling Edge of DREQ
DREQ
Address
bus
RD
HWR
TEND
,
LWR
T
1
T
2
T
1
DMAC cycle
T
2
T
1
T
2
End of 1 block transfer
T
1
T
2
T
1
Next sampling
Minimum 4 states
CPU cycle
T
2
DREQ
DREQ in Block Transfer Mode
DREQ
T
1
T
2
T
d
DMAC cycle
T
1
T
2