HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 715

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.28 (4) Useable Area for Erasure in User Boot Mode
Erasing
Procedure
Operation for Download Error
Operation for Settings of
Default Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
NMI Handling Routine
Rev. 2.0, 06/04, page 686 of 980
Item
Operation for
Selection of On-
chip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
Operation for
Key Register
Clear
Judgement of
Download Result
Storable/Executable Area
On-chip
RAM
User
Boot
MAT
External Space
(Expanded
Mode)
Selected MAT
User
MAT
User
Boot
MAT
Embedded
Program
Storage Area