HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 608

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.2
18.2.1
FWE pin
Mode pin
Overview
Block Diagram
Legend
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
RAMCR: RAM control register
FVACR: Flash vector address control register
FVADR: Flash vector address data register
Flash code control and status register
Flash program code select register
Flash erase code select register
Flash key code register
Figure 18. 1 Block Diagram of Flash Memory
FMATS
FTDAR
RAMCR
FVACR
FVADR
FCCS
FPCS
FECS
FKEY
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
User MAT: 512 kbytes
User boot MAT: 10 kbytes
Memory MAT unit
Rev. 2.0, 06/04, page 579 of 980