HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 214

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Notes:
No.
3
4
*1 Including switchovers from a low clock source to the halted state, and from the halted state to a low clock source.
*2 Including switchover from the halted state to a high clock source.
*3 Including switchover from a high clock source to the halted state.
*4 The switchover is regarded as a falling edge, causing RTCNT to increment.
High
switchover*
High
switchover*
CKS2 to CKS0
Write Timing
High
Low
4
3
Old clock source
New clock source
RTCNT clock
RTCNT
Old clock source
New clock source
RTCNT clock
RTCNT
N
N
RTCNT Operation
CKS bits rewritten
Rev. 2.0, 06/04, page 185 of 980
N+1
N+1
*
CKS bits rewritten
4
N+2
N+2

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