LPC1112FHN33/203,5 NXP Semiconductors, LPC1112FHN33/203,5 Datasheet - Page 178

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LPC1112FHN33/203,5

Manufacturer Part Number
LPC1112FHN33/203,5
Description
ARM Microcontrollers - MCU Cortex-M0 16kB flash up to 4 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN33/203,5

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
NXP Semiconductors
[3]
[4]
[5]
[6]
UM10398
User manual
5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis.
I
5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as a ADC input, digital section of the pad is disabled and the pin is not 5 V tolerant.
When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded
(grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating.
2
C-bus pads compliant with the I
2
C-bus specification for I
All information provided in this document is subject to legal disclaimers.
Rev. 12 — 24 September 2012
Chapter 11: LPC111x Pin configuration (LPC1100XL series,
2
C standard mode and I
2
C Fast-mode Plus.
UM10398
© NXP B.V. 2012. All rights reserved.
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