LPC1112FHN33/203,5 NXP Semiconductors, LPC1112FHN33/203,5 Datasheet - Page 56

no-image

LPC1112FHN33/203,5

Manufacturer Part Number
LPC1112FHN33/203,5
Description
ARM Microcontrollers - MCU Cortex-M0 16kB flash up to 4 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN33/203,5

Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
5.1 How to read this chapter
5.2 Features
5.3 Description
UM10398
User manual
Fig 11. Power profiles pointer structure
0x1FFF 1FF8
0x1FFF 1FFC
0x1FFF 2000
0x1FFF 2004
Ptr to ROM Driver table
The power profiles are available for parts LPC11(D)1x/102/202/302 only (LPC1100L
series).
The API calls to the ROM are performed by executing functions which are pointed by a
pointer within the ROM Driver Table.
Power Profiles API.
0x1FFF 2004
UM10398
Chapter 5: LPC111x/LPC11Cxx Power profiles
Rev. 12 — 24 September 2012
Includes ROM-based application services
Power Management services
Clocking services
Ptr to Device Table 0
Ptr to Device Table 1
Ptr to Device Table 2
Ptr to Device Table n
Ptr to PowerAPI Table
ROM Driver Table
All information provided in this document is subject to legal disclaimers.
Rev. 12 — 24 September 2012
Figure 11
shows the pointer structure used to call the
Device n
Ptr to Function 0
Ptr to Function 1
Ptr to Function 2
Ptr to Function n
Power API function table
set_power
set_pll
© NXP B.V. 2012. All rights reserved.
User manual
56 of 538

Related parts for LPC1112FHN33/203,5