LPC1112FHN33/203,5 NXP Semiconductors, LPC1112FHN33/203,5 Datasheet - Page 437
LPC1112FHN33/203,5
Manufacturer Part Number
LPC1112FHN33/203,5
Description
ARM Microcontrollers - MCU Cortex-M0 16kB flash up to 4 kB SRAM
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1113FHN333035.pdf
(538 pages)
Specifications of LPC1112FHN33/203,5
Rohs
yes
Core
ARM Cortex M0
Processor Series
LPC1112
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
16 KB
Data Ram Size
4 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.6 V
Operating Temperature Range
- 65 C to + 150 C
Package / Case
HVQFN-33
Mounting Style
SMD/SMT
Factory Pack Quantity
260
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NXP Semiconductors
26.9 Flash memory access
UM10398
User manual
Depending on the system clock frequency, access to the flash memory can be configured
with various access times by writing to the FLASHCFG register at address 0x4003 C010.
Remark: Improper setting of this register may result in incorrect operation of the
LPC111x/LPC11Cxx flash memory.
Table 407. Flash configuration register (FLASHCFG, address 0x4003 C010) bit description
Bit
1:0
31:2 -
Symbol
FLASHTIM
All information provided in this document is subject to legal disclaimers.
Value Description
0x0
0x1
0x2
0x3
-
Rev. 12 — 24 September 2012
Chapter 26: LPC111x/LPC11Cxx Flash programming firmware
Flash memory access time. FLASHTIM +1 is equal to the
number of system clocks used for flash access.
1 system clock flash access time (for system clock
frequencies of up to 20 MHz).
2 system clocks flash access time (for system clock
frequencies of up to 40 MHz).
3 system clocks flash access time (for system clock
frequencies of up to 50 MHz).
Reserved.
Reserved. User software must not change the value of
these bits. Bits 31:2 must be written back exactly as read.
UM10398
© NXP B.V. 2012. All rights reserved.
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value
10
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