ALXD800EEXJ2VD AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD Datasheet - Page 12

• Manufacturer Part Number: ALXD800EEXJ2VD
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VD

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

1.2
General Features
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CPU Processor Features
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GeodeLink™ Control Processor
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Functional blocks include:
— CPU Core
— GeodeLink™ Control Processor
— GeodeLink Interface Units
— GeodeLink Memory Controller
— Graphics Processor
— Display Controller
— Video Processor
— Video Input Port
— GeodeLink PCI Bridge
— Security Block
0.13 micron process
Packaging:
— 481-Terminal BGU (Ball Grid Array Cavity Up) with
Single packaging option supports all features
x86/x87-compatible CPU core
Performance:
— Processor frequency: up to 500 MHz
— Dhrystone 2.1 MIPs: 150 to 450
— Fully pipelined FPU
Split I/D cache/TLB (Translation Look-aside Buffer):
— 64 KB I-cache/64 KB D-cache
— 128 KB L2 cache configurable as I-cache, D-cache,
Efficient prefetch and branch prediction
Integrated FPU that supports the MMX
AMD 3DNow!™ instruction sets
Fully pipelined single precision FPU hardware with
microcode support for higher precisions
JTAG interface:
— ATPG, Full Scan, BIST on all arrays
— 1149.1 Boundary Scan compliant
ICE (in-circuit emulator) interface
Reset and clock control
Designed for improved software debug methods and
performance analysis
– TFT Controller/Video Output Port
internal heatspreader
or both
Features
33234C
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and
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GeodeLink™ Architecture
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GeodeLink™ Memory Controller
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2D Graphics Processor
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Power Management:
— Total Dissipated Power (TDP) 3.8W, 1.6W typical @
— GeodeLink active hardware power management
— Hardware support for standard ACPI software power
— I/O companion SUSP/SUSPA power controls
— Lower power I/O
— Wakeup on SMI/INTR
Designed to work in conjunction with the
AMD Geode™ CS5536 companion device
High bandwidth packetized uni-directional bus for
internal peripherals
Standardized protocol to allow variants of products to be
developed by adding or removing modules
GeodeLink Control Processor (GLCP) for diagnostics
and scan control
Dual GeodeLink Interface Units (GLIUs) for device inter-
connect
Integrated memory controller for low latency to CPU and
on-chip peripherals
64-bit wide DDR SDRAM bus operating frequency:
— 200 MHz, 400 MT/S
Supports unbuffered DDR DIMMS using up to 1 GB
DRAM technology
Supports up to 2 DIMMS (16 devices max)
High performance 2D graphics controller
Alpha BLT
Microsoft
— Hardware support for all Microsoft RDP codes
Command buffer interface for asynchronous BLTs
Second pattern channel support
Hardware screen rotation
500 MHz max power
management
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Windows
AMD Geode™ LX Processors Data Book
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GDI GUI acceleration:
Overview