ALXD800EEXJ2VD AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD Datasheet - Page 600

• Manufacturer Part Number: ALXD800EEXJ2VD
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VD

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

600
Symbol
I
I
I
LEAK
PU/PD
OH
Parameter
Input Leakage Current Including Hi-Z Output Leakage, Note 1
PCI
24/Q3
24/Q5
24/Q7
5V
DDR
DDRCLK
Weak Pull-Up/Down Current, Note 1
PCI
24/Q3
24/Q5
24/Q7
5V
DDR
DDRCLK
Output High Current, Note 1
PCI
24/Q3
24/Q5
24/Q7
5V
DDR (BA[1:0], MA[13:0])
DDR (DQ[63:0], CKE[1:0],
CS[3:0]#, RAS[1:0]#, CAS[1:0]#,
WE[1:0]#, DQS[7:0], DQM[7:0],
TLA[1:0]
DDRCLK
33234C
Table 7-4. DC Characteristics (Continued)
-24.0
-24.0
-24.0
-16.0
-15.2
-10.0
-500
Min
-3.0
-3.0
-3.0
-3.0
-3.0
-3.0
-5.0
-11
50
50
50
50
N/A
N/A
N/A
Max
150
150
150
150
3.0
3.0
3.0
3.0
3.0
3.0
5.0
AMD Geode™ LX Processors Data Book
Units
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
---
---
---
Comments
I
If V
I
These pull-downs are only
enabled during reset or
power sequencing system
behaviors. Note 2.
V
Note 2
drive set for pad
I
ter-drive set for pad
LEAK
OH
OH
O
IH
= V
min = -11 mA with half-
min = -8 mA with quar-
> V
max = 20 µA
Electrical Specifications
OH
IO
(Min)
,