ALXD800EEXJ2VD AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD Datasheet - Page 671

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ALXD800EEXJ2VD

Manufacturer Part Number
ALXD800EEXJ2VD
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of ALXD800EEXJ2VD

Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

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Appendix A: Support Documentation
A.1
Ordering information for the AMD Geode™ LX processors is contained in this section. The ordering part number (OPN) is
formed by a combination of elements. An example of the OPN is shown in Figure A-1. Valid OPN combinations are pro-
vided in Table A-1 on page 672.
AMD Geode™ LX Processors Data Book
ALX C
Note:
Spaces are added to the ordering number shown above for viewing clarity only.
800
Order Information
EE
OPN (Note)
T
J
Appendix
Figure A-1. AMD Geode™ LX Processors OPN Example
C
V
C
Case Temperature:
Display Type: V = CRT, TFT, and VOP
Cache/EEPROM Indicator:
System Bus Speed:
Operating Voltage:
Package Type: EE = BGU (TE-PBGA)
Performance Indicator:
Maximum Thermal Design Power (MTDP):
Family/Architecture: ALX = Geode™ LX Processor Family
Performance Indicator:
ASupport Documentation
T = 1.20V
X = 1.25V
C = 85°C Commercial
D = 85°C Commercial Pb-Free (Lead-Free)
J = 400 MHz memory, GeodeLink™ Architecture (500 MHz CPU)
H = 333 MHz memory, GeodeLink™ Architecture (433 MHz CPU)
800 operates at 500 MHz
700 operates at 433 MHz
2 = 128K L2 cache, No EEPROM
C = 128K L2 cache, With EEPROM
C ≤ 3W
D ≤ 4W
33234C
A
671

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