ALXD800EEXJ2VD AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD Datasheet - Page 612

• Manufacturer Part Number: ALXD800EEXJ2VD
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VD

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Note 1.
612
Symbol
TCLK limited during functional mode to 100 MHz or 1/4 of the memory data frequency.
Parameter
TCLK period
TCLK High time
TCLK Low time
TDI, TMS Setup time to TCLK rising edge
TMS Hold time from TCLK rising edge
TDI Hold time from TCLK rising edge - Boundary
scan
TDI Hold time from TCLK rising edge - Functional
TDO Output Valid Delay time from TCLK falling
edge when running boundary scan test
TDO Output Valid Delay time from TCLK falling
edge in normal functional mode
All chip I/O Setup time to TCLK rise - boundary
scan
All chip I/O Hold time from TCLK rise - boundary
scan
All chip I/O Output Valid Delay time from TCLK
falling edge - boundary scan test
33234C
Table 7-13. JTAG Interface Signals
2*T
Min
1.5
3.0
3.0
3.0
3.0
1.0
2.0
15
GLBus
4
4
3
AMD Geode™ LX Processors Data Book
Max
70.0
10.0
70.0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Electrical Specifications
Comments
Note 1
40% period
Hold for 2
GLBus clocks
40% period