ALXD800EEXJ2VD AMD (ADVANCED MICRO DEVICES), ALXD800EEXJ2VD Datasheet - Page 36

• Manufacturer Part Number: ALXD800EEXJ2VD
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJ2VD

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

3.4.3
3.4.4
36
Signal Name
DQ[63:0]
Signal Name
TCLK
TMS
TDI
TDO
TDBGI
TDBGO
Memory Interface Signals (DDR) (Continued)
Internal Test and Measurement Interface Signals
page 30
Table 3-
33234C
6 on
AC2
AA4
AB3
AC1
AB2
AB4
Ball
See
Ball
No.
No.
Type
Type
(PD)
I/O
O
O
I
I
I
I
166-400 Mb/s
0-400 Mb/s
0-400 Mb/s
0-66 Mb/s
0-66 Mb/s
0-66 Mb/s
0-66 MHz
f
f
3.3
3.3
3.3
3.3
3.3
3.3
V
2.5
V
Description
Test Clock. JTAG test clock.
Test Mode Select. JTAG test mode select.
Test Data Input. JTAG serial test data input.
Test Data Output. JTAG serial test data output.
Test Debug Input. The Debug Management Inter-
rupt (DMI) is input via TDBGI. The selects for
TDBGI are MSR programmable via the GLCP mod-
ule. When using TDBGI for DMI, it cannot be used
for other debug purposes. DMI can be setup via the
GLCP module to be edge sensitive or level sensi-
tive
Test Debug Output. The Geode LX processor can
output internal clocks on TDBGO. The selects for
TDBGO are MSR programmable via the GLCP
module. The internal clock can be selected from
any clock domain and may be divided down by 2 or
3 before output. This enables tester and board level
visibility of the internal clock quality.
Description
Memory Data Bus.
AMD Geode™ LX Processors Data Book
Signal Definitions