UPD78F1152AGC-GAD-AX Renesas Electronics America, UPD78F1152AGC-GAD-AX Datasheet - Page 840

• Manufacturer Part Number: UPD78F1152AGC-GAD-AX
• Description: MCU 16BIT 78K0R/KX3 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3r

Specifications of UPD78F1152AGC-GAD-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 65
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
838
Infrared reflow
Partial heating
Soldering Method
• 80-pin plastic LQFP (fine pitch) (12 × 12)
μ
μ
μ
μ
μ
PD78F1152GK-GAK-AX,
PD78F1153GK-GAK-AX,
PD78F1154GK-GAK-AX,
PD78F1155GK-GAK-AX,
PD78F1156GK-GAK-AX,
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Table 31-1. Surface Mounting Type Soldering Conditions (2/2)
CHAPTER 31 RECOMMENDED SOLDERING CONDITIONS
μ
μ
μ
μ
μ
PD78F1152AGK-GAK-AX,
PD78F1153AGK-GAK-AX,
PD78F1154AGK-GAK-AX,
PD78F1155AGK-GAK-AX,
PD78F1156AGK-GAK-AX,
User’s Manual U17893EJ8V0UD
Soldering Conditions
μ
μ
μ
μ
μ
Note
PD78F1152AGK(A)-GAK-AX,
PD78F1153AGK(A)-GAK-AX,
PD78F1154AGK(A)-GAK-AX,
PD78F1155AGK(A)-GAK-AX,
PD78F1156AGK(A)-GAK-AX,
(after that, prebake at 125°C for
IR60-107-3
Condition Symbol
Recommended
−