UPD78F1152AGC-GAD-AX Renesas Electronics America, UPD78F1152AGC-GAD-AX Datasheet - Page 906
UPD78F1152AGC-GAD-AX
Manufacturer Part Number
UPD78F1152AGC-GAD-AX
Description
MCU 16BIT 78K0R/KX3 80-LQFP
Manufacturer
Renesas Electronics America
Series
78K0R/Kx3r
Datasheet
1.UPD78F1152AGC-GAD-AX.pdf
(908 pages)
Specifications of UPD78F1152AGC-GAD-AX
Core Processor
78K/0R
Core Size
16-Bit
Speed
20MHz
Connectivity
3-Wire SIO, I²C, LIN, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
65
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Part Number
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Quantity
Price
Company:
Part Number:
UPD78F1152AGC-GAD-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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904
7th edition
Edition
Addition of description to 23.4 Setting of Option Byte
Addition of PG-FP5, FL-PR5, and QB-MINI2 as dedicated flash memory
programmers
Change of Figure 24-6 Format of Background Event Control Register (BECTL)
Change of Table 24-4 Communication Modes
Addition of 24.8 Processing Time of Each Command When Using PG-FP4 or PG-
FP5 (Reference Values)
Addition of Caution 5 to 24.9 Flash Memory Programming by Self-Programming
Change of description in 24.9.2 Flash shield window function
Change of Caution in 25.1 Connecting QB-MINI2 to 78K0R/KF3
Addition of Caution to Figure 25-1 Connection Example of QB-MINI2 and
78K0R/KF3
Change of Table 25-1 Differences Between 1-Line Mode and 2-Line Mode
Change of Table 27-1 Operand Identifiers and Specification Methods and change
of Remark
Change of description in 27.1.4 PREFIX instruction
Addition of Remarks in Table 27-5. Operation List
Change of Table 27-5 Operation List (17/17)
Change of Caution
Addition of recommended oscillator constants
Change of “Conditions” column and MAX. values of output current, low (I
Characteristics
Change of “Conditions” column of output voltage, low (V
Change of typical supply current value of all products, deletion of “(Target)” from
supply currents of
DC Characteristics
Modification of “Conditions” column of instruction cycle and change of external main
system clock frequency and external main system clock input high-level width, low-
level width in (1) Basic operation in AC Characteristics
Addition of expanded-specification products specifications to (d) During
communication at same potential (simplified I
Serial array unit
Change of overall error and integral linearity error values in A/D Converter
Characteristics
Addition of A/D converter characteristics of expanded-specification products
Addition of temperature sensor
Addition of Remark to D/A Converter Characteristics
Change of V
expanded-specification product characteristics in Flash Memory Programming
Characteristics
Addition of chapter
Addition of chapter
DD
supply current value and number of rewrites and addition of
μ
PD78F1167 and 78F1168, and change of values during f
APPENDIX C REVISION HISTORY
User’s Manual U17893EJ8V0UD
Description
2
C mode) in (2) Serial interface:
OL1
) in DC Characteristics
OL1
) in DC
SUB
in
CHAPTER 23 OPTION
BYTE
CHAPTER 24 FLASH
MEMORY
CHAPTER 25 ON-CHIP
DEBUG FUNCTION
CHAPTER 27
INSTRUCTION SET
CHAPTER 28
ELECTRICAL
SPECIFICATIONS
(STANDARD
PRODUCTS)
CHAPTER 29
ELECTRICAL
SPECIFICATIONS ((A)
GRADE PRODUCTS)
(TARGET)
APPENDIX B LIST OF
CAUTIONS
Chapter
(20/20)
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