DF2117VT20V Renesas Electronics America, DF2117VT20V Datasheet - Page 41

• Manufacturer Part Number: DF2117VT20V
• Description: MCU 16BIT FLASH 3V 160K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2117VT20V

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: FIFO, I²C, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 112
• Program Memory Size: 160KB (160K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

25.2 Duty Correction Circuit ..................................................................................................... 838
25.3 Subclock Input Circuit ....................................................................................................... 838
25.4 Subclock Waveform Forming Circuit ................................................................................ 839
25.5 Clock Select Circuit ........................................................................................................... 839
25.6 Usage Notes ....................................................................................................................... 840
Section 26 Power-Down Modes ..........................................................................841
26.1 Register Descriptions ......................................................................................................... 841
26.2 Mode Transitions and LSI States ....................................................................................... 848
26.3 Medium-Speed Mode......................................................................................................... 850
26.4 Sleep Mode ........................................................................................................................ 851
26.5 Software Standby Mode..................................................................................................... 851
26.6 Watch Mode....................................................................................................................... 853
26.7 Module Stop Mode ............................................................................................................ 854
26.8 Usage Notes ....................................................................................................................... 854
Section 27 List of Registers .................................................................................855
27.1 Register Addresses (Address Order).................................................................................. 856
27.2 Register Bits....................................................................................................................... 878
27.3 Register States in Each Operating Mode............................................................................ 896
27.4 Register Selection Condition ............................................................................................. 912
27.5 Register Addresses (Classification by Type of Module).................................................... 934
Section 28 Electrical Characteristics ...................................................................957
28.1 Absolute Maximum Ratings .............................................................................................. 957
28.2 DC Characteristics ............................................................................................................. 958
28.3 AC Characteristics ............................................................................................................. 963
25.1.1 Connecting Crystal Resonator .............................................................................. 834
25.1.2 External Clock Input Method................................................................................ 835
25.6.1 Notes on Resonator ............................................................................................... 840
25.6.2 Notes on Board Design ......................................................................................... 840
26.1.1 Standby Control Register (SBYCR) ..................................................................... 842
26.1.2 Low-Power Control Register (LPWRCR) ............................................................ 844
26.1.3 Module Stop Control Registers H, L, A, and B (MSTPCRH, MSTPCRL,
26.8.1 I/O Port Status....................................................................................................... 854
26.8.2 Current Consumption when Waiting for Oscillation Stabilization ....................... 854
28.3.1 Clock Timing ........................................................................................................ 964
28.3.2 Control Signal Timing .......................................................................................... 966
28.3.3 Timing of On-Chip Peripheral Modules ............................................................... 968
MSTPCRA, MSTPCRB) ...................................................................................... 845
Rev. 2.00 Sep. 28, 2009 Page xxxix of xl
REJ09B0452-0200