DF2117VT20V Renesas Electronics America, DF2117VT20V Datasheet - Page 747

• Manufacturer Part Number: DF2117VT20V
• Description: MCU 16BIT FLASH 3V 160K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2117VT20V

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: FIFO, I²C, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 112
• Program Memory Size: 160KB (160K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Note:
21.4.2
The SPI flash memory transfer is performed using FSIDO and FSIDI synchronously with FSICK.
The initial value of FSICK can be either fixed to high or low through programming.
The FSI supports byte, word, and longword transfers of FW memory read and write cycles. In
word transfer, the least address bit is fixed to B'0; while in longword transfer, the lower 2 bits are
fixed to B'00. When longword transfers of FW memory write cycles are used, the maximum
operating frequency of the system clock is 10 MHz.
State
Counts Content
17
18
FSISS
FSICK
FSIDO
FSIDI
* The number of wait cycles depends on the system clock.
Turn-around
(recovery)
Turn-around
SPI Flash Memory Transfer
FW Memory Read Cycles
MSB
Bit7
Figure 21.2 Example of SPI Flash Memory Transfer
Bit6
Driven by
Slave
None
Bit5
Bit4
Bit3
Value (3 to 0)
1111
ZZZZ
Bit2
Bit1
LSB
Bit0
MSB
Bit7
Content
Turn-around
(recovery)
Turn-around None
Bit6
Rev. 2.00 Sep. 28, 2009 Page 705 of 994
FW Memory Write Cycles
Bit5
Bit4
Driven by
Slave
Bit3
Bit2
Bit1
REJ09B0452-0200
Value (3 to 0)
1111
ZZZZ
Bit0
LSB