DF2117VT20V Renesas Electronics America, DF2117VT20V Datasheet - Page 873

MCU 16BIT FLASH 3V 160K 144-TQFP

DF2117VT20V

Manufacturer Part Number
DF2117VT20V
Description
MCU 16BIT FLASH 3V 160K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2117VT20V

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
FIFO, I²C, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
112
Program Memory Size
160KB (160K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2117VT20V
Manufacturer:
Renesas
Quantity:
100
Part Number:
DF2117VT20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
24.13
1. The initial state of the product at its shipment is in the erased state. For the product whose
2. For the PROM programmer suitable for programmer mode in this LSI and its program version,
3. If the socket, socket adapter, or product index does not match the specifications, too much
4. Use a PROM programmer that supports the device with 256-Kbyte on-chip flash memory and
5. Do not power off the Vcc power supply (including the removal of the chip from the PROM
6. The flash memory is not accessible until FKEY is cleared after programming/erasing starts. If
7. At powering on the Vcc power supply, fix the RES pin to low and set the flash memory to
8. In on-board programming mode or programmer mode, programming of the 128-byte
9. When the chip is to be reprogrammed with the programmer after execution of programming or
10. To program the flash memory, the program data and program must be allocated to addresses
11. If data other than H'FF (4 bytes) is written to the key code area (H'00003C to H'00003F) of the
revision of erasing is undefined, we recommend to execute automatic erasure for checking the
initial state (erased state) and compensating.
refer to the instruction manual of the socket adapter.
current flows and the product may be damaged.
3.3 V programming voltage. Use only the specified socket adapter.
programmer) during programming/erasing in which a high voltage is applied to the flash
memory. Doing so may damage the flash memory permanently. If a reset is input, the reset
must be released after the reset input period of at least 100μs.
the operating mode is changed and this LSI is restarted by a reset immediately after
programming/erasing has finished, secure the reset input period (period of RES = 0) of at least
100μs. Transition to the reset state during programming/erasing is inhibited. If a reset is input
accidentally, the reset must be released after the reset input period of at least 100μs.
hardware protection state. This power on timing must also be satisfied at a power-off and
power-on caused by a power failure and other factors.
programming-unit block must be performed only once. Perform programming in the state
where the programming-unit block is fully erased.
erasure in on-board programming mode, it is recommended that automatic programming is
performed after execution of automatic erasure.
which are higher than those of the external interrupt vector table and H'FF must be written to
all the system reserved areas in the exception handling vector table.
flash memory, reading cannot be performed in programmer mode. (In this case, data is read as
H'00. Rewrite is possible after erasing the data.) For reading in programmer mode, make sure
to write H'FF to the entire key code area.
Usage Notes
Rev. 2.00 Sep. 28, 2009 Page 831 of 994
REJ09B0452-0200

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