HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 143

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 2.3
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM *
STM *
Notes: 1. Refers to the operand size.
2
2
2. Only register ER0 to ER6 should be used when using the STM/LDM instruction.
B:
W: Word
L:
Data Transfer Instructions
Byte
Longword
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (EAd)
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+ → Rn (register list)
Rn (register list) → @–SP
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Rn → @–SP
Pops two or more general registers from the stack.
Pushes two or more general registers onto the stack.
Rev. 6.00 Mar. 18, 2010 Page 81 of 982
REJ09B0054-0600
Section 2 CPU

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