HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 80

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 1 Overview
(5) Pin Arrangement of H8S/2227 Group
Figures 1.15 and 1.16 show the pin arrangement of the H8S/2227 Group.
Rev. 6.00 Mar. 18, 2010 Page 18 of 982
REJ09B0054-0600
P70/TMRI01/TMCI01/CS4
(TFP-100B, TFP-100BV, TFP-100G, TFP-100GV, FP-100B*, FP-100BV*: Top View)
Note: * Masked ROM version only.
P32/SCK0/IRQ4
P35/SCK1/IRQ5
P73/TMO1/CS7
P72/TMO0/CS6
PG1/CS3/IRQ7
P74/MRES
P75/SCK3
PG0/IRQ6
P31/RxD0
P34/RxD1
P76/RxD3
P30/TxD0
P33/TxD1
P77/TxD3
PG2/CS2
PG3/CS1
PG4/CS0
P71/CS5
PE0/D0
PE1/D1
PE2/D2
PE3/D3
PE4/D4
P36
Figure 1.15 Pin Arrangement of H8S/2227 Group
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
(TOP VIEW)
TFP-100BV
TFP-100GV
FP-100BV*
TFP-100B
TFP-100G
FP-100B*
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P42/AN2
P43/AN3
P44/AN4
P45/AN5
P46/AN6
P47/AN7
P96
P97
AVSS
P17/TIOCB2/TCLKD
P16/TIOCA2/IRQ1
P15/TIOCB1/TCLKC
P14/TIOCA1/IRQ0
P13/TIOCD0/TCLKB/A23
P12/TIOCC0/TCLKA/A22
P11/TIOCB0/A21
P10/TIOCA0/A20
PA3/A19
PA2/A18
PA1/A17
PA0/A16
PB7/A15
PB6/A14
PB5/A13
PB4/A12