HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 964

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 27 Electrical Characteristics
Item
WDT1
A/D
converter
Note:
Rev. 6.00 Mar. 18, 2010 Page 902 of 982
REJ09B0054-0600
SCI *
* The high level of P35/SCK1 and P34 is driven by NMOS. In order to output a high level
BUZZ output delay time
Input clock
cycle
Input clock pulse width
Input clock rise time
Input clock fall time
Transmit data delay time
Receive data setup time
(synchronous)
Receive data hold time
(synchronous)
Trigger input setup time
at V
CC
= 4.5 V or below, a pull-up resistance must be connected externally.
Asynchronous
Synchronous
Symbol
t
t
t
t
t
t
t
t
t
BUZD
Scyc
SCKW
SCKr
SCKf
TXD
RXS
RXH
TRGS
Min
0.4
75
75
40
4
6
Conditions A, B
Max
100
0.6
1.5
1.5
100
Unit
ns
t
t
ns
ns
ns
ns
t
cyc
Scyc
cyc
Test Conditions
Figure 27.30
Figure 27.32
Figure 27.33
Figure 27.31

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