HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 823

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 22.4 DC Characteristics in PROM Mode
(Conditions: V
Item
Input high voltage
Input low voltage
Output high voltage EO7 to EO0
Output low voltage EO7 to EO0
Input leakage
current
V
V
CC
PP
current
current
CC
= 6.0 V ±0.25 V, V
EO7 to EO0,
EO7 to EO0,
EA16 to EA0,
OE, CE, PGM
EA16 to EA0,
OE, CE, PGM
EO7 to EO0,
EA16 to EA0,
OE, CE, PGM
PP
= 12.5 V ±0.3 V, V
Symbol Min
V
V
V
V
| I
I
I
CC
PP
IH
IL
OH
OL
LI
|
2.4
–0.3 —
2.4
Rev. 6.00 Mar. 18, 2010 Page 761 of 982
SS
Typ
= 0 V, T
Max
V
0.8
0.45
2
40
40
CC
a
+ 0.3
= 25°C ±5°C)
Unit
V
V
V
V
µA
mA
mA
Section 22 PROM
REJ09B0054-0600
Test
Conditions
I
I
V
5.25 V/0.5 V
OH
OL
in
= 1.6 mA
= –200 µA
=

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