HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 981

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Item
Read data access time 2
Read data access time 3
Read data access time 4
Read data access time 5
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time
Write data setup time
Write data hold time
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus-floating time
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
ACC2
ACC3
ACC4
ACC5
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
BRQS
BACD
BZD
Min
1.0 × t
− 30
1.5 × t
− 30
0.5 × t
− 37
0.5 × t
− 15
50
10
50
Condition A
cyc
cyc
cyc
cyc
Max
1.5 × t
− 65
2.0 × t
− 65
2.5 × t
− 65
3.0 × t
− 65
50
50
70
50
80
cyc
cyc
cyc
cyc
Rev. 6.00 Mar. 18, 2010 Page 919 of 982
Min
1.0 × t
− 60
1.5 × t
− 60
0.5 × t
− 80
0.5 × t
− 60
90
10
90
Conditions B, C
Section 27 Electrical Characteristics
cyc
cyc
cyc
cyc
Max
1.5 × t
− 90
2.0 × t
− 90
2.5 × t
− 90
3.0 × t
− 90
90
90
100
90
160
cyc
cyc
cyc
cyc
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REJ09B0054-0600
Test
Conditions
Figures 27.14
to 27.18
Figure 27.16
Figure 27.19

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